Integrated Wiring
Complexity of modern systems has significantly increased demands on power and signal distribution networks. A single aircraft may house miles of bundled wire for power management, signal transmission, and buses that bridge circuits and power sources. Such networks are costly to install and maintain, and are susceptible to heat- or vibration-induced damage which may lead to shorting or fire. Replacing these vast networks with structurally-integrated wiring, either deposited conformally onto surfaces or embedded within composite structures, can reduce installation costs and susceptibility to damage.
MesoScribe’s Direct Write (DW) process has drawn attention as a promising option for embedding conductors on air vehicles. Its ability to deposit low-profile conductors and dielectrics over large areas, and embed the networks within complex composite layups, can enable such integrated wiring approaches for multifunctional structures. State-of-the-art Direct Write copper conductors are being sought for deployment on flight-critical structures for:
- Power Management
- Signal Routing and Distribution
- Conformal Antenna Structures
- Sophisticated Sensor Applications
Direct Write conductor traces demonstrate superior durability to conventional bonded copper foil, exhibiting only modest changes in resistance after millions of fatigue cycles. Resistivity can be tailored by application, and has been driven below 2X bulk for copper conductors. Conductors can also be insulated and shielded for signal routing, using dielectric materials commonly patterned via Direct Write. MesoScribe’s Direct Write conductors have been selected for a variety of aerospace applications, and are currently used by partner OEMs on flight-critical production aerostructures.
