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MesoScribe Technologies has moved!
February 4, 2009 - MesoScribe's Corportate Headquarters and East Coast Development Lab have moved from the Long Island High Technology Incubator to our new, larger location in St. James, NY. MesoScribe still maintains its West Coast Development Lab in Huntington Beach, CA.[See more news.]
MesoScribe Technologies, Inc. (MST) combines expertise in direct-write technology, embedded sensors and RF antennas. [Learn more about us.]
The direct-write process creates functional electronic components particle-by-particle, producing low-cost, micrometer-sized devices without additional post processing. [Learn more about direct-write technology.]
MST's core specialty lies in exploiting the benefits of direct-write technology to produce accurate, conformal, inexpensive, tolerant devices for harsh environments. [Learn more about our harsh-environment sensors.]
Since 2002, MST has been developing direct-write sensors and antennas for government agencies and private entities. [Learn more about our programs.]
MST operates fabrication, design and testing facilities at its headquarters in NY. [Learn more about our facilities.]
MesoScribe is located in St. James, NY and Huntington Beach, CA. [Contact us at MesoScribe Technologies.]
MesoScribe Brochure ![Mesoscribe brochure [pdf - 3.3MB]](content/pdf_icon.gif)
MesoScribe Technologies, Inc. (MST) is engaged in the development and commercialization of new fabrication processes to make sensor products for harsh environments capable of withstanding high temperatures (1200°C) that can be applied onto a variety of materials of complex shapes and/or be embedded within coatings. These electronic devices are fabricated by spraying heated powders thru apertures directly onto surfaces. This Direct Write (DW) process creates functional electronic components particle-by-particle, producing low-cost, micrometer-sized devices without additional post-processing. The Company is commercializing its temperature and strain sensors for use in the gas turbine engine industry.
MesoScribe Technologies, Inc. was spun-off from Stony Brook University and incorporated in early 2002. The Company’s mission is to provide our customers and strategic partners with enabling capabilities that will revolutionize the knowledge, operation, maintenance, state awareness and failure prediction of components operating in harsh environments.
Expertise
MST has built expertise in DW with application to:
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Harsh-environment sensors |
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Antennas |
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Conformal deposition |
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Circuit components |
The company is focusing its development and commercialization efforts on the following key areas:
- Embedded harsh environment sensors for use in gas turbine engines
- High temperature passive and active wireless sensing
- Conformal and integrated antennas
Personnel
The management team represents an experienced mixture of industrial, manufacturing, sensor R&D, and business expertise. Mr. Richard Gambino is the CEO/CTO of MesoScribe and previously worked at IBM for 31 years, receiving the National Medal of Technology from President Bill Clinton in 1995. Mr. Robert Greenlaw is developing the proprietary process hardware and tooling and previously spent 12 years working in OEM turbine engine shops.
MesoScribe's senior personnel are:
- Dr. Jeff Brogan - CEO
- Mr. Richard J Gambino - CTO
- Mr. Robert J Greenlaw - Vice President of Engineering
- Prof. Sanjay Sampath - Technical Advisor
- Prof. Jon Longtin - Technical Advisor
Traditional Thermal Spray Technology
Traditional thermal spray technology is a large area spray process in which material, generally in molten form, is accelerated to high velocities and impinged upon a substrate, where a dense and strongly adhered deposit is formed by rapid solidification. Material is injected in the form of a powder, wire or rod into a high velocity combustion or thermal plasma flame, which imparts thermal and kinetic energy to the particles. By controlling the plume characteristics and material state (e.g., molten, softened), it is possible to deposit a wide range of materials (metals, ceramics, polymers, semiconductors and combinations thereof) onto virtually any substrate in various conformal shapes. The ability to melt, rapidly solidify and consolidate introduces the possibility of the synthesizing useful deposits at or near ambient temperature. The deposit is built-up by successive impingement of droplets, which yield flattened, solidified platelets, referred to as splats.
Direct-Write
Direct-write is an extension of the thermal spray deposition process and was developed at SUNY-Stony Brook under DARPA's Mesoscopic Integrated Conformal Electronics (MICE) Initiative. The stated aim of the MICE program was to fabricate electronics that were robust, easily integrated with conventional electronics, and that conformed to the surfaces onto which they were placed, with the ultimate goal of depositing a GPS antenna on a soldier's helmet. These electronic devices are fabricated by spraying heated powders thru apertures directly onto surfaces. This Direct Write (DW) process creates functional electronic components particle-by-particle, producing low-cost, micrometer-sized devices without additional post-processing. Thus, rather than depositing material over large areas, Direct Write deposits material in precision patterns enabling the design and production of embedded sensors. The component and the desired electronic device patterns are laid out as a computer-aided-design (CAD) file. This CAD drawing is uploaded to the automation system driving the DW tools allowing for the direct fabrication of the desired devices without using conventional masks associated with fine-featured (100-500 micrometers) devices. Computer designs along with the existing automation equipment ensure DW capabilities on objects of complex, conformal geometries. Direct Write allows for deposition of blankets, patches and lines of a variety of sensor, electronic and coating materials. These are done at high speeds, efficiently and at low cost. Via based interconnections are possible in a multilayer system through hybrid laser drilling and filling systems. All of the above can be accomplished on conformal substrates. A variety of DW-based sensors have been developed, including thermocouples, thermopiles, strain gauges, humidity and chemical sensors, micro-heaters, magnetic sensors, and heat flux sensors. These sensors are fabricated using the same thermal spray technology as that used for under coats, bond coats, and overcoats on the substrates themselves. Indeed, thermal spray has been used for decades to provide enhanced wear, increased temperature resistance, and component longevity. The intrinsic self-compatibility of DW sensors with the coatings in which they reside make for an extremely robust, high-reliability sensing system. Furthermore, because of the nature of the direct write process, it is straightforward to deposit sensors on large areas, conformable surfaces, and even flexible surfaces, as discussed below. Because of the ease in which a large number of sensors can be deposited and integrated, DW can provide the ability to perform real-time damage assessments of vital components in a reliable, cost-effective manner.
Advantages of Direct-Write
The virtues and unique advantages of thermal spray with respect to direct write electronics fabrication and related processes are numerous: • High throughput manufacturing based on high speed direct writing capability • In-situ application of metals, ceramics, polymers or any combinations of these materials; without thermal treatment or curing • Useful materials properties in the as-deposited state • Cost effective, efficient processing at ambient conditions in virtually any environment • Limited thermal input during processing, allowing for deposition onto a variety of substrates • Robotics-capable for difficult-to-access/severe environments (site-applicability using portable tools.) • Readily available for customizing special sensor systems (i.e., prototyping) • Green technology vis-à-vis plating, lithography, etc. • Can apply on a wide range of substrates and conformal shapes • Rapidly translatable development to manufacturing (using existing infrastructure).
Direct-Write References
- Sampath, S., "Novel Concepts in Direct Writing of Electronics and Sensors", 2005. Longtin, J., Sampath, S., Tankiewicz, S., Gambino, R.J. and R.J. Greenlaw, "Sensors for Harsh Environments by Direct-Write Thermal Spray", IEEE Sensors Journal, Vol. 4, No. 1, February 2004.
- Tong, T. et al., "Ultrafast laser micromachining of thermal sprayed coatings for microheaters: design, fabricationand characterization", Sensors and Actuators A 114 (2004) 102-111.
- Sampath, S., et al. "Direct-Write Thermal Spraying of Multilayer Electronics and Sensor Structures", Direct-Write Technologies for Rapid Prototyping Appplications, A. Pique and D. Chrisey (editors), Academic Press, 2002.
Direct Write allows for deposition of a variety of sensor, electronic and coating materials. These are done at high speeds, efficiently and at low cost. Via based interconnections are possible in a multilayer system through hybrid laser drilling and filling systems. All of the above can be accomplished on conformal substrates. A variety of DW-based sensors have been developed, including thermocouples, thermopiles, strain gages, humidity and chemical sensors, micro-heaters, magnetic sensors, and heat flux sensors. MST is most actively developing the following:
Strain Gages
Direct-write strain gages behave similarly to adhesively-bonded resistive foil or wire strain gages. They employ a serpentine electrical conductor whose resistance changes in proportion to strain. DW gages possess superior adhesion to substrates versus conventionally-bonded gages: the splat-by-splat deposition process constructs the device on the part, ensuring a very strong interface. The heat and kinetic energy of the metallic particles create the adhesion necessary to secure the device, so no adhesive nor polymer encapsulation is required. The metallic and ceramic components are inherently high-temperature tolerant.
The low profile and mass of the multilayer device make it suitable for both rotational and wetted environments e.g., gas turbines. In addition, high-temperature interrogation leads for the devices can be deposited by direct-write, so that interconnects can be located outside the harsh-environment.
Thermocouples and Heat Flux sensors
Thermocouple elements are embedded onto engineering components using direct-write. The composition of the deposits matches that of NIST standard wire thermocouples, ensuring compatibility between direct-write TCs and commercially available leads, junctions and temperature readers. These low-profile devices can be embedded within functional coatings, such as TBCs to monitor internal environments.
Leads may be deposited conformally (on curved components) for easy routing between interconnects and areas of interest. Multiple thermcouples combined in a multilayer function as heat flux sensors for monitoring intergrity of thermal protection and other systems.
Wireless and Antennas
For harsh or rotating environments, engineering the data path between sensors and remote monitoring equipment is particularly challenging. Extensive lead wiring, power for sensor excitation and data transmission, and communication between rotating and stationary components all threaten successful harsh-environment sensor integration. MesoScribe provides solutions for wireless interrogation of sensors and other devices using direct-write antennas and other RF components.
Novel Design and Fabrication of Conformal GPS & Communications Antenna for UAV
Sponsor: Air Force Contract No. FA8650-08-M-1382
Partner: Ohio State University
Summary: This Phase I project will develop and demonstrate the feasibility of integrating VHF / UHF communications antenna, and GPS L1/L2 band antennas into the UAV structures to provide multiband, 360-degree coverage without significant impact on aerodynamics, and designed to occupy the smallest practical surface area at the lowest weight practical. MesoScribe Technologies Inc. in partnership Ohio State University and EDO Corporation propose an integrated strategy combining design, simulation and Direct Write antenna fabrication to implement the combined GPS & Communications antenna technology onto the tail/fuselage of a surrogate UAV. The program will serve as a platform to meet the project objectives as well as validate a new approach to integrate conformal antennas within military systems.
Harsh-Environment Sensors for In-Flight Hypersonic Engine Tests
Sponsor: AFRL Contract No. FA8650-08-C-2866
Partner: Pratt & Whitney Rocketdyne, ATK-GASL
Summary: MesoScribe Technologies seeks to improve sensor concepts demonstrated under Phase I to meet program requirements for scramjet monitoring. Thermocouples, heat flux sensors and skin friction sensors were produced during Phase I using Mesoplasma direct write, a high precision derivative of thermal spray deposition processes. Under this phase of the program, a series of tests and design revisions are proposed which aim to improve sensor performance iteratively, by changing patterns, materials, deposition parameters, and by adding subtractive processing steps i.e., laser-cutting, to reduce sensor size and weight. Sensor specifications will be determined through consultation with program sponsors and program partner Pratt & Whitney Rocketdyne.
Conformal, Embedded Harsh Environment Sensors for In-Situ Sensing in Gas Turbines
Sponsor: NAVAIR Contract No. N68335-08-C-0034
Partner: Arkansas Power Electronics International, Inc.
Summary: MesoScribe Technologies and its development team will fabricate embedded sensors using Direct Write technology for use in aircraft engine environments and demonstrate wireless data transmission at high temperature. A principal focus is the development of a wireless sensing capability which involves the design and fabrication of a transmitter as well as a power delivery system using SiC electronics. In addition, the Team aims to deliver consistent sensor performance over the lifetime of the sensor, examine engine integration issues, and validate sensor functionality on OEM components.
An Integrated Approach to Sensor Materials Synthesis, Design and Fabrication for Extreme Temperature Applications
Sponsor: AFOSR Contract No. FA9550-07-C-0133
Partner: University of Rhode Island, HiTec Products, Inc.
Summary: MesoScribe Technologies seeks to improve sensor concepts demonstrated under Phase I to meet program requirements for scramjet monitoring. Thermocouples, heat flux sensors and skin friction sensors were produced during Phase I using Mesoplasma direct write, a high precision derivative of thermal spray deposition processes. Under this phase of the program, a series of tests and design revisions are proposed which aim to improve sensor performance iteratively, by changing patterns, materials, deposition parameters, and by adding subtractive processing steps i.e., laser-cutting, to reduce sensor size and weight. Sensor specifications will be determined through consultation with program sponsors and program partner Pratt & Whitney Rocketdyne.
Integrated Sensing and Modeling for Damage Assessment in Multifunctional Composites
Sponsor: ARO Contract No. W911NF-05-C-0077
Partner: Northrop Grumman, SUNY-Stony Brook
Summary: MesoScribe Technologies and project partner SUNY-Stony Brook will develop embedded sensors with integrated mechanics-based models to assess and predict accumulated damage in graphite reinforced epoxy composite structures. Meaningful evaluation schemes for composite degradation will be developed using advanced interpretation procedures based on inverse analysis techniques. This novel approach is essential to quantify material systems containing complex microstructures based on information collected from structurally integrated sensors. The proposed sensors will be fabricated by Direct Write technology and integrated within the composite structure to measure strain, temperature, cracking, etc and new sensors designed to measure UV light will be examined. The aim is to establish robust evaluation procedures with rigorous multi-degradation testing followed by intelligent data processing methods and use this approach to design and develop next generation material/structural systems. Northrop Grumman will provide project guidance during the course of this Phase I STTR with the goal of implementing the developed techniques for use in a number of DoD applications. Specific applications of interest include composite rotor blades, vehicle components, and structures exposed to combined degradation mechanisms.
Innovative Concepts for Wireless Strain Sensing in Turbine Engines
Sponsor: AFOSR Contract No. FA9550-05-C-0127
Partner: Pratt & Whitney, SUNY-Stony Brook
Summary: MesoScribe Technologies proposes the development of a passive wireless strain system based on the Company's innovative Direct Write technology. Embedded circuit elements will be fabricated directly onto the surfaces of compressor blades and stator vanes. The sensors themselves will be very low weight and low profile. A strictly passive strain monitoring configuration is proposed where a resonant circuit on the rotating blade relays information to an appropriately equipped stationary vane, which will serve to interrogate the rotating blade through magnetic coupling. Considerations include compensation for dielectric constant and temperature coefficient of resistance using multiple orientations for strain sensors to accommodate and monitor strain in various locations. Additionally, this Phase I proposal will address maximizing signal-to-noise ratios to improve signal fidelity, optimizing sensitivity, and signal extraction from the stationary stator to provide adequate sampling rates, eg. 45-50 kHz. Also, the avoidance of silicon-based active devices, the lack of an external power source, and the small mass and low profile nature of the proposed strain sensors are all considerable advantages that could bring profound new sensing and monitoring capabilities to turbine engine systems. Together with project partner SUNY-Stony Brook and OEM partner, Pratt & Whitney a strong team has been constructed to meet the proposed development objectives.
Ubiquitous Low-Cost Wireless Sensors for Power Line Monitoring
Sponsor: Dept. of Energy Grant No. DE-FG02-05ER84150
Partner: Long Island Power Authority
Summary: The operation and control of power lines is of strategic importance to the electric utility sector and to the nation as a whole. Power grids are complex networks of distribution cables, which are fairly remotely located, and are also susceptible to environmental and man-made events; therefore, their monitoring infrastructure must be reliable and effective. Furthermore, when energy demands reach near peak capacity, efficient delivery of electricity is crucial. This project will develop power line sensors and a passive wireless sensor system to monitor the conductor current and conductor temperature of electrical power lines. The sensors will be low cost, able to survive harsh environments, and deployable without interruption of power service. The state of the sensor can be remotely interrogated and the conductor performance can be continuously monitored. Phase I will design and fabricate passive wireless sensors suitable for power-line monitoring. The sensors will consist of planar inductors and multi-layer capacitors to measure conductor current and conductor temperature. Phase II will involve magnetic and electric characterization, laboratory testing, signal conditioning, and wireless radio frequency (RF) interrogation. Field testing with a local utility will take place during Phase II.
Innovative Concepts for Distributed, Large Area, Rectenna Arrays
Sponsor: DARPA Contract No. W31P4Q-05-C-0164
Partner: Raytheon, EDO Corp.
Abstract: MesoScribe Technologies, Inc, in conjunction with program partner EDO Antenna Products and DoD transition partner Raytheon Corporation, proposes to examine the design issues, materials technology and the feasibility of implementing a space based large area collection rectenna. System level considerations such as integration, cost and transport will addressed. Component level issues including substrate, antenna element, schottky junction diode and thermal management concepts will be addressed during the initial design phase. Materials and device characteristics will also examined during the design phase and preliminary fabrication and characterization will be conducted. MesoScribe's novel direct write technology along with EDO's advanced design capability is expected to provide a unique framework for examining this far reaching concept. The successful development of component and/or system level technology can have dual use applicability. The SBIR program will provide a framework to develop a team and assess the technology.
Conformal Direct-Write-Technology-Enabled, Wireless, Smart Turbine Components
Sponsor: Dept. of Commerce/NIST Award No. 70NANB4H3042
JV Partner: Siemens Power Generation
Summary: Condition-based maintenance is the increasingly popular concept of monitoring the "health" of essential machinery so that it can be shut down for maintenance when - and only when - it needs it. The efficient, high-performance gas turbines predominantly used to generate electricity are very expensive pieces of equipment used in an extremely competitive industry. Every hour off-line costs money. To date, it has been impossible to apply true condition-based maintenance to gas turbines because the extremely harsh operating conditions in the heart of a gas turbine preclude using the necessary advanced sensors to monitor the machine's condition continuously. Siemens Westinghouse Power Corporation in a joint venture with partner MesoScribe Technologies Inc. (Stony Brook, N.Y.) proposes a potentially industry-changing technology to build smart, self-aware engine components that incorporate wireless embedded, harsh-environment-capable sensors for continuously monitoring machine condition. One key development issue is the need to embed sensors on complex shapes, such as turbine blades. MesoScribe Technologies is developing a process break-through called Conformal Direct-Write(TM) technology, based on research at the State University of New York at Stony Brook, for directly depositing sensor components on complex surfaces. Siemens Westinghouse will integrate this technology with a wireless telemetry system to relay the sensor data to assess turbine condition while it is operating. The new technology would make a dramatic change in operating and maintenance procedures in the electric power industry and other industries. The technology has the potential to save operators and owners of gas and steam turbines over $86 M per year through lower cost of operation and lower emissions.
Distributed Electronics
Sponsor: DARPA Contract No. W31P4Q-04-C-R302
Partner: EDO Corp., NRL, Boeing, NUWC
Summary: MesoScribe Technologies proposes to expand upon the successful Phase I results to develop Distributed Electronics using the newly developed Direct Write Thermal Spray Technology (DWTS) with the goal of fabricating devices directly onto large area conformal substrates that can provide sensing, information transmission, communications, processing, storage, and signal routing. The Phase II program will focus on three principal thrust areas: (1) the integration of active devices, (2) the enhancement of core capabilities including sensors, passive devices, conductors, etc. and (3) refining the Direct Write fabrication tool to support future transitioning of large area distributed electronics including the ability for portable applications. An interdisciplinary team has been formed consisting of materials and process development (MesoScribe and Stony Brook University), TFT design and testing (Princeton) and application development (EDO-Antenna Products and Technologies, Naval Research Laboratory, Naval Undersea Warfare Center, Air Force Wright Labs, Boeing and Raytheon Corp). The team will focus on enabling the technology with potential applications in distributed antennas, distributed electromagnetics, distributed sensing, and submarine smart-skin concepts. Successful implementation of this Phase II effort will pave the way for an exciting alternative to traditional microelectronics fabrication, in terms of both cost-effective device capabilities onto conformal/flexible surfaces, and technology insertion into defense and commercial applications.
Embedded Sensors in Turbine Systems by Direct Write Thermal Spray Technology
Sponsor: Dept. of Energy Grant No. DE-FG02-02ER83497
Partner: HiTec Products, SUNY-Stony Brook
Summary: Monitoring the performance of high temperature components in advanced gas turbine engines is an important element in the accelerated insertion of advanced materials, coatings and novel designs. By continuously collecting component temperature and strain information using embedded sensors, one can assess the state of a component, provide feedback on the efficiency and performance of the engine as well as the health of engineering components. This effort will focus on identifying key components in turbine engines suited for applicability of embedded sensor technology for condition monitoring. Sensor and infrastructure designs will be optimized, and assessed with respect to design criteria, survivability and behavior of the integrated system. This breakthrough technology is a new approach that makes it possible to integrate sensors directly on actual components and structures, and will provide strategic advantages to US industry.
MesoScribe Technologies, Inc. (“MST”) operates facilities in the United States. MST's corporate headquarters and testing laboratory are located at in St. James, NY, near Stony Brook University.
Design
- 2D software for single-layer device design
- OneCNC 2.5D software for multi-layer device design
- Alibre, Solidworks 3D software for component design and integration
Fabrication
- Direct-Write and High Definition spray processing
- Parallel-gap micro-welder
- Additional fabrication facilities available at SUNY-Stony Brook through a formal facilities use agreement
Testing and Analysis
- Automated cyclic strain actuator
- High-temperature static strain rig
- Signal conditioning strain amplifier
- Automated thermal-cyclic furnace
- Cyclic burner rig
- Isothermal long-duration furnace
- Humidity chamber
- AccuraSpray diagnostics
- Transmission line test apparatus
- RF probe station
- Metallographic stereoscope
- Matlab data analysis software
MesoScribe Technologies has moved!
February 4, 2009 - MesoScribe's Corportate Headquarters and East Coast Development Lab have moved from the Long Island High Technology Incubator to our new, larger location in St. James, NY. MesoScribe still maintains its West Coast Development Lab in Huntington Beach, CA.
MesoScribe selected for Phase I STTR award from AFOSR
November 17, 2008 - MesoScribe has been selected for a Phase I award, "High-Temperature Thermal/Environmental Barrier Coatings for Silicon Carbide Composites".
MesoScribe selected for Phase I SBIR award from AFRL
November 5, 2008 - MesoScribe has been selected for a Phase I award, "Ceramic Materials Optimization and Thermocouple Fabrication".
MesoScribe selected for Phase I SBIR award from AFRL
November 4, 2008 - MesoScribe has been selected for a Phase I award, "Aware Composite Structures".
MesoScribe selected for Phase I SBIR award from AFRL
November 4, 2008 - MesoScribe has been selected for a Phase I award, "Integration of Direct-Write Sensors and Interconnects for Sounding Rocket Payload Test Platforms".
MesoScribe receives Phase II STTR award from AFOSR
July 9, 2008 - MesoScribe has been selected for a Phase II award, "An Integrated Approach to Sensor Materials Synthesis, Design and Fabrication for Extreme Temperature Applications".
MesoScribe receives Phase I SBIR award from AFRL/RYR
May 16, 2008 - MesoScribe has been selected for a Phase I award, "Novel Design and Fabrication of Conformal GPS & Communications Antenna for UAV" under Air Force contract FA8650-08-M-1382.
MesoScribe receives Phase II SBIR award from AFRL/RZAS
February 21, 2008 - MesoScribe has been selected for a Phase II award, "Harsh Environment Sensors for In-Flight Hypersonic Engine Tests" under Air Force contract FA8650-08-C-2866.
MesoScribe receives Phase II SBIR award from NAVAIR
November 19, 2007 - MesoScribe has been awarded a Phase II award, "Conformal, Embedded Harsh Environment Sensors for In-Situ Sensing in Gas Turbines" under Navy contract N68335-08-C-0034.
MesoScribe, Stony Brook University receive R&D100 award
October 18, 2007 - R&D Magazine awarded MesoScribe Technologies and Stony Brook University a 2007 R&D100 award yesterday, for its MesoPlasma Direct Write thermal spray system.
MesoScribe receives Phase II SBIR award from AFRL/RXLMN
October 18, 2007 - MesoScribe has been awarded a Phase II award, "Embedded high-temperature sensors for in-situ interrogation and damage prognosis" under Air Force contract FA8650-07-C-5223.
MesoScribe receives Phase II SBIR award from AFRL/RBSA
September 21, 2007 - MesoScribe has been awarded a Phase II award, "Surface-Engineered Multifunctional Large-Area Capacitors Integrated within Aerospace Structures" under Air Force contract FA8650-07-C-3715.
MesoScribe receives Phase II SBIR award from NASA
December 3, 2006 - MesoScribe has been awarded a Phase II award, "Enabling Technologies for Fabrication of Large Area Flexible Antennas" under NASA contract NNC07CA28C.
MesoScribe receives Phase II STTR award from ARO
September 9, 2006 - MesoScribe has been awarded a Phase II award, "Integrated Sensing and Modeling for Damage Assessment in Multifunctional Composites" under Army contract W911NF-06-C-0180.
MesoScribe Technologies team selected for NIST-ATP award
November 19, 2004 - The U.S. Department of Commerce's National Institute of Standards and Technology - Advanced Technology Program (NIST-ATP) awarded the Siemens Westinghouse (SWPC) and MesoScribe Technologies, Inc. team a four-year, $5.4 Million program. The target is to develop embedded sensors capable of withstanding harsh environments and integrate them in a wireless telemetry system to enable thermal, mechanical and wear sensing in operating gas turbines for condition-based maintenance. The proposed program focuses on the area of smart coatings for component condition monitoring and is scheduled to start in November 2004.
The program will accelerate development and verification of the embedded sensor technology which is essential to prime reliance on coatings for superior turbine performance and availability. The new technology aims to promise turbine operators in power generation as well as in aviation or marine propulsion dramatic improvements by enabling condition based maintenance. MesoScribe's technology has the potential to save operators and owners of gas and steam turbines worldwide over $86 million per year through lower cost of operation and lower emissions.
MesoScribe Technologies, Inc. is developing new fabrication processes and products for conformal and embedded sensor applications in harsh environments. The Company was incorporated in 2002 and spun-off from the State University of New York (SUNY) at Stony Brook to commercialize the break-throughs in Direct Write (DW) technology arising from the DARPA Mesoscopic Integrated Conformal Electronics (MICE) initiative. DW has emerged as a cost-effective and versatile method to fabricate high performance electronic materials, electro-magnetics and sensors. MesoScribe is currently located at the Long Island High Technology Incubator in Stony Brook, NY.
Corporate Headquarters7 Flowerfield, Suite 28 |
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West Coast Development Center5445 Oceanus Drive #108 |
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InternetE-mail: info@mesoscribe.com |